2027 Themes
AP International 2027 Themes
The key technical themes shaping the 2027 programme - each covering presentations and panel sessions from across the Advanced Packaging community.
Chiplets and Heterogeneous Integration
How are chiplets and heterogeneous integration changing the way advanced systems are designed, manufactured and packaged for performance, yield and scalability?
- 3 presentations
Scaling and Pilot Lines
What role will pilot lines, process scale-up and manufacturing readiness play in moving advanced packaging technologies from development into volume production?
- 3 presentations
Precision Equipment for Scalable Advanced Packaging
How can European automation and packaging equipment providers help deliver the precision, throughput and reliability needed for next-generation advanced packaging?
- 4 presentations
Materials for Packaging Performance
How are European and Japanese advances in substrates, underfills and connectors enabling higher-density, more reliable and more manufacturable advanced packages?
Thermal Management and Reliability
How can the industry overcome rising thermal and reliability challenges as advanced packages become more powerful, compact and complex?
Design and Simulation
How can design and simulation tools help optimise package architectures, reduce development risk and accelerate the path from concept to production?