Pushing beyond monolithic design. With more functions packed into a single package, how can advanced integration of dies and technologies reshape performance in compact systems?

The classics endure for a reason, but how can proven formats like wirebond and leadframe be reimagined and optimised to deliver cutting-edge performance at scale?

How can smarter thermal strategies unlock next-gen performance? From real-time in-package measurements and simulations to heat extraction, what are the best ways to manage rising thermal challenges in today’s packages?

From performance breakthroughs to scalable integration, which strategies will define the future of advanced packaging?