Push past the limits of monolithic design. Explore how integrating multiple dies, functions, and technologies in a single package is reshaping what’s possible in high-performance and compact systems.

Proven packaging solutions like wirebond and leadframe still offer exceptional performance at scale. Discover how smart optimisation is unlocking new performance in legacy formats for today’s demanding applications.

Next-generation materials are rewriting the rules of thermal management. See how synthetic diamond and advanced heat spreaders are solving critical cooling challenges in high-density, high-power devices.

Go beyond surface readings. Uncover cutting-edge methods to map internal heat flow, boost reliability, and fine-tune designs with real-time, in-package thermal data.

2.5D, 3D, chiplet, and beyond. Dive into the architectures powering the next wave of semiconductor innovation, from performance breakthroughs to cost-effective integration strategies.

Accelerate time-to-market with powerful thermal simulations. Learn how predictive modelling tools are eliminating guesswork and enabling thermally optimised designs from the start.