Speakers

2026 Speaker Profiles

The Advanced Packaging International 2026 conference attracts many industry leading experts from all the major companies involved in the global packaging industry.

If you are interested in speaking at Advanced Packaging International, please contact [email protected] or call +44 (0)2476 718 970.

2026 Speakers Include

CEA Leti
Chips Weekly
Custom Interconnect
Finetech
Fraunhofer IZM
GlobalFoundries
IBM
Instituto de Telecomunicações
Multibeam
National Manufacturing Institute Scotland
NHanced Semiconductors
Physik
Raith Laser Systems BV
RAM Innovations
University of Bristol
Vanguard Automation
Conference Chairs
Peter O'Brien
Tyndall National Institute

Heterogeneous Integration

Getting the Best Out of Incumbent Solutions

Dr Gladys Benghalia
National Manufacturing Institute Scotland
Nick Russel
RAM Innovations
Sander Schellingerhout
Raith Laser Systems BV

Advancing Thermal Management

Joana Mendes
Instituto de Telecomunicações
Zeina Abdallah
University of Bristol

Optimising Packaging Architectures

Theme to be confirmed