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[email protected] +44 (0)24 7671 8970
AP International
12-14 April 2027Brussels, Belgium
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AP International
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12-14 April 2027 / Brussels, Belgium

2027 Speakers

2027 Speaker Profiles

AP International attracts industry leaders and academic experts shaping the materials, methods and technologies behind chip-level packaging and system integration.

If you are interested in speaking at AP International, please contact [email protected] or call +44 (0)24 7671 8970.

TechSearch International
Femtum
Lidrotec GmbH
Siconnex
Tyndall National Institute

Chairpeople

2027 chairpeople

Chiplets and Heterogeneous Integration

How are chiplets and heterogeneous integration changing the way advanced systems are designed, manufactured and packaged for performance, yield and scalability?

Scaling and Pilot Lines

What role will pilot lines, process scale-up and manufacturing readiness play in moving advanced packaging technologies from development into volume production?

Precision Equipment for Scalable Advanced Packaging

How can European automation and packaging equipment providers help deliver the precision, throughput and reliability needed for next-generation advanced packaging?