Speakers

2026 Speaker Profiles

The Advanced Packaging International 2026 conference attracts many industry leading experts from all the major companies involved in the global packaging industry.

If you are interested in speaking at Advanced Packaging International, please contact [email protected] or call +44 (0)2476 718 970.

2026 Speakers Include

CEA Leti
Chips Weekly
Custom Interconnect
Finetech GmbH
Fraunhofer IZM
GlobalFoundries
IBM
Instituto de Telecomunicações
Lidrotec GmbH
Multibeam
National Manufacturing Institute Scotland
NHanced Semiconductors
NXP Semiconductors
Physik
Raith Laser Systems BV
RAM Innovations
SHELLBACK Semiconductor Technology
Siconnex Customized Solutions GmbH
Syenta
University of Bristol
Vanguard Automation
Yole Group
Conference Chairs
Peter O'Brien
Tyndall National Institute
Tyler J. Myers
Forge Nano, Inc

Getting the Best Out of Incumbent Solutions

Dr Gladys Benghalia
National Manufacturing Institute Scotland
Nick Russel
RAM Innovations
Phillip Sundin
SHELLBACK Semiconductor Technology
Sander Schellingerhout
Raith Laser Systems BV

Advancing Thermal Management

Joana Mendes
Instituto de Telecomunicações
Zeina Abdallah
University of Bristol

Optimising Packaging Architectures

Theme to be confirmed
Christian Keil
Lidrotec GmbH
Dr. Pascal Oberndorff
NXP Semiconductors
Name to be advised
Yole Group
Name to be advised
Siconnex Customized Solutions GmbH