Speakers

2026 Speaker Profiles

The Advanced Packaging International 2026 conference attracts many industry leading experts from all the major companies involved in the global packaging industry.

If you are interested in speaking at Advanced Packaging International, please contact [email protected] or call +44 (0)2476 718 970.

2026 Speakers Include

AEMtec
AIM Photonics
Amkor Technology
ATLANT 3D
CEA Leti
Chips Weekly
Custom Interconnect
cyberTECHNOLOGIES
Evatec
Finetech GmbH
FMD / APECS
Fraunhofer IZM
Ghent University - imec
GlobalFoundries
IBM
imec
Instituto de Telecomunicações
Jabil
Lidrotec GmbH
Multibeam
National Advanced Semiconductor Packaging and Integration Centre (NASPIC)
NHanced Semiconductors
NXP Semiconductors
PHIX Photonics Assembly
Photon Bridge
Physik
PITC
Raith
RAM Innovations
SHELLBACK Semiconductor Technology
Siconnex
Square Zero Technologies
SUSS Micro Tec
Syenta
Tyndall National Institute
University of Bristol
Vanguard Automation
Yole Group
Conference Chairs
Peter O'Brien
Tyndall National Institute
Tyler J. Myers
Forge Nano, Inc

Heterogeneous Integration

Getting the Best Out of Incumbent Solutions

Dr Gladys Benghalia
National Advanced Semiconductor Packaging and Integration Centre (NASPIC)
John Boston
Custom Interconnect
Nick Russel
RAM Innovations
Phillip Sundin
SHELLBACK Semiconductor Technology

Advancing Thermal Management

Joana Mendes
Instituto de Telecomunicações
Zeina Abdallah
University of Bristol

Optimising Packaging Architectures

Manufacturing & Pilot Lines

Materials, Design and Reliability

AngelTech Rump Session
David Cheskis
Square Zero Technologies
Diana Khlan
Chips Weekly