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AP International
12-14 April 2027Brussels, Belgium
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12-14 April 2027 / Brussels, Belgium

2027 Abstracts

AP International 2027 Presentation Abstracts

Detailed abstracts for every 2027 presentation, grouped by theme. Click a speaker to see their full bio.

Chiplets and Heterogeneous Integration

How are chiplets and heterogeneous integration changing the way advanced systems are designed, manufactured and packaged for performance, yield and scalability?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. From Monolithic to Chiplet: What Does Repackaging Europe’s Exascale Processor Involve?

    SiPearl’s Rhea1 is a large monolithic die with HBM, while its successor, Rhea2, moves to a chiplet-based architecture. This talk will explore what drove that transition, the packaging and supply-chain constraints that shaped the design choices, and what a European processor company needs from the packaging ecosystem to bring it to market.

Scaling and Pilot Lines

What role will pilot lines, process scale-up and manufacturing readiness play in moving advanced packaging technologies from development into volume production?

  1. Advanced Packaging Outlook: Demand, Capacity and Supply-Chain Constraints

    AI infrastructure is reshaping advanced packaging demand, increasing requirements for large-body, high-density substrates, memory integration and complex package architectures. Drawing on TechSearch International’s Advanced Packaging Update, this presentation will examine market forecasts, OSAT activity, substrate capacity and emerging supply-chain constraints. It will highlight where shortages may restrict growth, how package and substrate requirements are evolving, and what these trends mean for technology providers, manufacturers and investors across the advanced packaging ecosystem.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

  3. From Lab to Fab: Europe’s 300mm Hand-over Point for 3D Heterogeneous Integration

    The future of 3D integration depends on one critical step: turning promising technologies into fab-ready 300 mm processes. Fraunhofer IZM-ASSID bridges this gap with an industry-oriented 300 mm platform for 3D heterogeneous integration on wafer level. It provides the environment to develop, validate, and scale advanced integration technologies before their transfer into manufacturing. With CEASAX we will further strengthen this capability through an additional 900 m² of cleanroom space in Dresden. The talk will present the key 300 mm technologies for next-generation 3D integration, demonstrate how APECS pilot-line activities can reduce technology-transfer risks, and discuss what it takes to move innovative processes successfully from R&D to pilot scale manufacturing and ultimately into the fab.

Precision Equipment for Scalable Advanced Packaging

How can European automation and packaging equipment providers help deliver the precision, throughput and reliability needed for next-generation advanced packaging?

  1. To Be Confirmed

    Abstract for this presentation is being finalised.

  2. To Be Confirmed

    Abstract for this presentation is being finalised.

  3. To Be Confirmed

    Abstract for this presentation is being finalised.