Monday 20th April 2026 starting at 11:00 CET

11:00 AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register 18:00 Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

Tuesday 21st April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Conference Chair Heterogeneous Integration 09:00 Silicon to Systems: How Advanced Packaging Is Redefining Performance Scaling Presented by Diana Khlan - Chips Weekly 09:20 Bridging the Gap: Collaborative Industry - Research Ecosystems in Advanced Packaging Presented by Ulrike Ganesh - Fraunhofer IZM 09:40 Sub-Micron Active Alignment: Accelerating Chiplet and Photonics Assembly with Piezo Motion Presented by Name to be advised - Physik 10:00 Heterogeneous Integration and Co-packaged Optics: Meeting AI Bandwidth Demand Presented by Himani Suhag Kamineni - GlobalFoundries 10:20 Advanced Photonic Assembly for Co-Packaged Optics Presented by Bert Offrein - IBM 10:40 Morning Break - Refreshments & Networking 11:10 Foundry 2.0: A New Foundation for Semiconductors and Innovation Presented by Robert Patti - NHanced Semiconductors 11:30 Localized Electrochemical Manufacturing (LEM): A Scalable High-Density Interconnect Platform for Next-Generation Heterogeneous Integration Presented by Sebastiaan Muller - Syenta 11:50 Thin Film Deposition Developments for Large Size Packages on Panel Scale Presented by Andre Schenk - Evatec 12:10 From Innovation to High-Volume Production: Scaling Heterogeneous Integration and Co-Packaged Optics Presented by Anneirudh Sundararajan - PHIX Photonics Assembly 12:30 Lunch Break, Networking & Posters Manufacturing & Pilot Lines 14:00 Supporting the European Advanced Packaging Ecosystem in HVM and Innovation Presented by Eoin O’Toole - Amkor Technology 14:20 Process Integration in Redistribution Layer Manufacturing Presented by Bernhard Hammerl - Siconnex 14:40 Assembly Design Kit Challenges and Opportunities Presented by David Harame - AIM Photonics 15:00 APECS European Advanced Packaging Pilot Line Presented by Johannes Rittner - Fraunhofer IPMS 15:20 High Volume Packaging OSAT Presented by Massimo Leo - Jabil 15:40 Afternoon Break and Networking Materials, Design and Reliability 16:10 The European Chip Design Platform (EuroCDP): Enabling Access to Advanced Semiconductor Design in Europe Presented by Helio Fernandez Tellez - imec 16:30 From Miniaturization to System Integration: The Growing Role of Semiconductor Packaging Presented by Dr. Pascal Oberndorff - NXP Semiconductors 16:50 Next-generation silicon photonics platforms enabled by micro-transfer printing – The TRANSVERSE Pilot Line Presented by Gunther Roelkens - Ghent University - imec 17:10 Design Enablement of a Heterogeneously Integrated Electronic-Photonic System in a Package Presented by Sylwester Latkowski - PITC 17:30 Packaging Reliability for Space and High Reliability Environments Presented by Finbarr Waldron - Tyndall National Institute 17:50 Closing Remarks 18:00 Networking Drinks / Dinner Reception 18:30 AngelTech Rump Session Presented by David Cheskis - Square Zero Technologies, and Diana Khlan - Chips Weekly

Wednesday 22nd April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Conference Chair Advancing Thermal Management 09:00 Beating the Heat: Diamond as an Enabler for High-Performance Advanced Packages Presented by Joana Mendes - Instituto de Telecomunicações 09:20 Advanced Thermal Management in High-Power Electronics Packaging Using Metal-Diamond Composite Heat Spreaders Presented by Zeina Abdallah - University of Bristol 09:40 Direct Atomic Layer Processing (DALP®): Spatially Localized, Multi-Material Fabrication for Next-Generation Devices from Discovery to Manufacturing Presented by Mira Baraket - ATLANT 3D Getting the Best Out of Incumbent Solutions 10:00 From Capability to Scale: Accelerating the Advanced Packaging Ecosystem Presented by Dr Gladys Benghalia - National Advanced Semiconductor Packaging and Integration Centre (NASPIC) 10:20 Beyond the Mask: Multibeam Laser Lithography for Cost-effective, Flexible, and High-Precision Advanced Packaging Presented by Sander Schellingerhout - Raith 10:40 Panel-Level Embedded Die Packaging for High-Performance WBG Power Modules Presented by Nick Russel - RAM Innovations 11:00 Morning Break and Networking 11:30 Optimising Legacy Wet Strip for Advanced Packaging Presented by Phillip Sundin - SHELLBACK Semiconductor Technology 11:50 Beyond the Standard: Redefining Semiconductor Packaging as a Specialized OSAT Presented by Daniel Lieske - AEMtec 12:10 Medium Volume Production and Advanced Packaging in the UK Presented by John Boston - Custom Interconnect 12:30 Photonics Packaging Moving Toward Scalability for a Fast-growing Market Presented by Eric Mounier - Yole Group 12:50 Lunch Break, Networking & Posters Optimising Packaging Architectures 14:00 Recent Developments in Advanced Heterogeneous 3D Integration at the Wafer Level Presented by Jean-Charles Souriau - CEA Leti 14:20 Photonic Wire Bonds and Facet-Attached Micro-Lenses: Enabling Scalable Integration of Lasers and PICs Presented by Laura Horan - Vanguard Automation 14:40 A Sustainable Dicing Innovation for Cutting-Edge Semiconductor Challenges Presented by Christian Keil - Lidrotec GmbH 15:00 Advanced Packaging Methods for Heterogeneous Integration Presented by Travis Scott - Finetech GmbH 15:20 Afternoon Coffee Break 15:40 Digital Coating: Scalable and Material Saving Material Deposition Presented by David Volk - SUSS Micro Tec 16:00 Accelerating the Future: Enabling the Next Era of Advanced Integration with Multibeam- High-Productivity E-Beam Lithography Presented by Ken MacWilliams - Multibeam 16:20 Eliminating Sub-Micron Alignment: Self-Aligned Cantilever Packaging for Scalable Silicon Photonics Presented by Paul Marchal - Photon Bridge 16:40 Closing Remarks