Monday 20th April 2026 starting at 11:00 CET

11:00 AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register 18:00 Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

Tuesday 21st April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Conference Chair Heterogeneous Integration 09:00 Silicon to Systems: How Advanced Packaging Is Redefining Performance Scaling Presented by Diana Khlan - Chips Weekly 09:20 Bridging the Gap: Collaborative Industry - Research Ecosystems in Advanced Packaging Presented by Ulrike Ganesh - Fraunhofer IZM 09:40 Heterogeneous Integration and Co-packaged Optics: Meeting AI Bandwidth Demand Presented by Himani Suhag Kamineni - GlobalFoundries 10:00 Presentation by IBM Presented by Bert Offrein - IBM 10:20 Morning Break - Refreshments & Networking 10:50 Sub-Micron Active Alignment: Accelerating Chiplet and Photonics Assembly with Piezo Motion Presented by Name to be advised - Physik 11:10 Accelerating the Future: Enabling the Next Era of Advanced Integration with Multibeam- High-Productivity E-Beam Lithography Presented by Ken MacWilliams - Multibeam 11:30 Presentation by NHanced Semiconductors Presented by Robert Patti - NHanced Semiconductors 11:50 Localized Electrochemical Manufacturing (LEM): A Scalable High-Density Interconnect Platform for Next-Generation Heterogeneous Integration Presented by Sebastiaan Muller - Syenta 12:10 From Innovation to High-Volume Production: Scaling Heterogeneous Integration and Co-Packaged Optics Presented by Anneirudh Sundararajan - PHIX Photonics Assembly 12:30 Lunch Break and Networking Manufacturing & Pilot Lines 14:00 Process Integration in Redistribution Layer Manufacturing Presented by Bernhard Hammerl - Siconnex Design, Simulation and Reliability 14:20 Presentation by NXP Semiconductors Presented by Dr. Pascal Oberndorff - NXP Semiconductors 14:40 Closing Remarks 15:40 Networking Drinks / Dinner Reception

Wednesday 22nd April 2026 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Conference Chair Advancing Thermal Management 09:00 Beating the Heat: Diamond as an Enabler for High-Performance Advanced Packages Presented by Joana Mendes - Instituto de Telecomunicações 09:20 Advanced Thermal Management in High-Power Electronics Packaging Using Metal-Diamond Composite Heat Spreaders Presented by Zeina Abdallah - University of Bristol Getting the Best Out of Incumbent Solutions 09:40 Presentation by National Manufacturing Institute Scotland Presented by Dr Gladys Benghalia - National Manufacturing Institute Scotland 10:00 Beyond the Mask: Multibeam Laser Lithography for Cost-effective, Flexible, and High-Precision Advanced Packaging Presented by Sander Schellingerhout - Raith 10:20 Panel-Level Embedded Die Packaging for High-Performance WBG Power Modules Presented by Nick Russel - RAM Innovations 10:40 Morning Break and Networking 11:10 Green Alternative Fabrication Processes Presented by Phillip Sundin - SHELLBACK Semiconductor Technology 11:30 Presentation by AEMtec Presented by Daniel Lieske - AEMtec 11:50 Presentation by Yole Presented by Eric Mounier - Yole Group 12:10 Medium Volume Production and Advanced Packaging in the UK Presented by John Boston - Custom Interconnect Optimising Packaging Architectures 12:30 Recent Developments in Advanced Heterogeneous 3D Integration at the Wafer Level Presented by Jean-Charles Souriau - CEA Leti 12:50 Advanced packaging methods for Heterogeneous Integration Presented by Travis Scott - Finetech GmbH 13:10 Lunch Break and Networking 14:40 Presentation by SUSS Micro Tec Presented by David Volk - SUSS Micro Tec 15:00 Presentation by Lidrotec GmbH Presented by Christian Keil - Lidrotec GmbH 15:20 Presentation by Photon Bridge Presented by Paul Marchal - Photon Bridge