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Monday 20th April 2026 starting at 18:00 CET
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18:00
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Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)
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Tuesday 21st April 2026 starting at 08:00 CET
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08:00
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Registration and welcome refreshments
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08:50
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Housekeeping by Conference Chair
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Heterogeneous Integration
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09:00
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From Silicon to Systems: How Advanced Packaging Enables the Next Generation of AI and Power Semiconductor Innovation
Presented by Diana Khlan - Chips Weekly
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09:20
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Presentation by Fraunhofer IZM
Presented by Ulrike Ganesh - Fraunhofer IZM
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09:40
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Presentation by GlobalFoundries
Presented by Himani Suhag Kamineni - GlobalFoundries
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10:00
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Presentation by IBM
Presented by Arvind Kumar - IBM
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10:20
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Morning Break - Refreshments & Networking
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10:50
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Sub-Micron Active Alignment: Accelerating Chiplet and Photonics Assembly with Piezo Motion
Presented by Name to be advised - Physik
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11:10
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Accelerating the Future: Enabling the Next Era of Advanced Integration with Multibeam- High-Productivity E-Beam Lithography
Presented by Ken MacWilliams - Multibeam
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11:30
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Presentation by NHanced Semiconductors
Presented by Robert Patti - NHanced Semiconductors
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11:50
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Localized Electrochemical Manufacturing (LEM): A Scalable High-Density Interconnect Platform for Next-Generation Heterogeneous Integration
Presented by Sebastiaan Muller - Syenta
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Advancing Thermal Management
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11:50
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Beating the Heat: Diamond as an Enabler for High-Performance Advanced Packages
Presented by Joana Mendes - Instituto de Telecomunicações
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12:10
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Advanced Thermal Management in High-Power Electronics Packaging Using Metal-Diamond Composite Heat Spreaders
Presented by Zeina Abdallah - University of Bristol
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12:30
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Lunch Break and Networking
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Getting the Best Out of Incumbent Solutions
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14:00
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Presentation by National Manufacturing Institute Scotland
Presented by Dr Gladys Benghalia - National Manufacturing Institute Scotland
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14:20
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Beyond the Mask: Multibeam Laser Lithography for Cost-effective, Flexible, and High-Precision Advanced Packaging
Presented by Sander Schellingerhout - Raith Laser Systems BV
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14:40
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Presentation by RAM Innovations
Presented by Nick Russel - RAM Innovations
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15:00
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Green Alternative Fabrication Processes
Presented by Phillip Sundin - SHELLBACK Semiconductor Technology
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15:00
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Afternoon Break and Networking
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Optimising Packaging Architectures
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15:30
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Recent Developments in Advanced Heterogeneous 3D Integration at the Wafer Level
Presented by Jean-Charles Souriau - CEA Leti
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15:50
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Presentation Title to be Confirmed
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16:10
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Presentation by Custom Interconnect Limited
Presented by John Boston - Custom Interconnect
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16:30
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Advanced packaging methods for Heterogeneous Integration
Presented by Travis Scott - Finetech GmbH
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18:00
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Networking Drinks / Dinner Reception
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Presentation times and order are subject to change. This agenda was last updated on 13 Dec 2025 at 2:56pm.
