Advanced Packaging International
The 1st Advanced Packaging International will feature a blend of keynotes, technical presentations, panel discussions and poster sessions, offering a platform for deep technical exchange and industry-driven discussion. Across two days, leaders from industry and academia will explore the technologies, materials, and methods redefining chip-level packaging and integration.
Attendees will engage with six key themes:
- Heterogeneous Integration
- Standard Packages: Getting the Best Out of Incumbent Solutions
- Maximising Heat Extraction with Diamond and Other Heat Spreaders
- Measuring the Thermal Profile Within the Package
- Optimising Packaging Architectures
- Simulating the Temperature Profile Over a Device
Alongside curated talks and expert panels, the dedicated poster session offers additional opportunities for knowledge sharing, technical depth, and peer-to-peer engagement.
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