Connecting the Advanced Packaging Industry

The 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation. Over two days, industry leaders and academic experts will deliver around 40 presentations across four key themes:

• Heterogeneous Integration
• Getting the Best Out of Incumbent Solutions
• Advancing Thermal Management
• Optimising Packaging Architectures

Conference attendees will gain insights into the materials, methods, and technologies reshaping chip-level packaging and system integration. From cutting-edge thermal solutions to the reimagination of wirebond and leadframe formats, the event provides a comprehensive look at how packaging is enabling system-level innovation.

The two-day conference also includes expert panels and a dedicated poster session, creating multiple avenues for peer-to-peer engagement and technical exchange across the packaging ecosystem - from researchers and R&D teams to product engineers and system architects.

Advanced Packaging International is part of AngelTech, which delivers a portfolio of insightful, informative, and highly valued chip-level conferences. Bringing together an Innovation Summit and four co-located conferences with more than 120 presentations, 700+ delegates, and over 80 exhibitors, AngelTech is the premier global event covering compound semiconductor, photonic integrated circuit, power electronic, and advanced packaging technologies. With significant overlap between the conferences, attendees benefit from exposure to full supply chains, customer bases, and partner ecosystems.

Register Visit AngelTech Website