Connecting the Advanced Packaging Industry
The 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation. Over two days, industry leaders and academic experts will deliver around 40 presentations across four key themes:
- Heterogeneous Integration
- Getting the Best Out of Incumbent Solutions
- Advancing Thermal Management
- Optimising Packaging Architectures
Conference attendees will gain insights into the materials, methods, and technologies reshaping chip-level packaging and system integration. From cutting-edge thermal solutions to the reimagination of wirebond and leadframe formats, the event provides a comprehensive look at how packaging is enabling system-level innovation.
The two-day conference also includes expert panels and a dedicated poster session, creating multiple avenues for peer-to-peer engagement and technical exchange across the packaging ecosystem - from researchers and R&D teams to product engineers and system architects.
AP International is part of AngelTech, bringing together an Innovation Summit, four co-located conferences and an exhibition with more than 120 presentations, more than 700 delegates and over 80 exhibitors. AngelTech is the only global event covering Compound Semiconductor, PICs, Power Electronics and Advanced Packaging technologies, bringing the key executives all together under one roof for three days of networking and insight.
Register
Visit AngelTech Website