# AP International 2027 Themes

The key technical themes shaping the 2027 programme.

## Chiplets and Heterogeneous Integration

How are chiplets and heterogeneous integration changing the way advanced systems are designed, manufactured and packaged for performance, yield and scalability?

## Scaling and Pilot Lines

What role will pilot lines, process scale-up and manufacturing readiness play in moving advanced packaging technologies from development into volume production?

1 presentation.

## Precision Equipment for Scalable Advanced Packaging

How can European automation and packaging equipment providers help deliver the precision, throughput and reliability needed for next-generation advanced packaging?

## Materials for Packaging Performance

How are European and Japanese advances in substrates, underfills and connectors enabling higher-density, more reliable and more manufacturable advanced packages?

## Thermal Management and Reliability

How can the industry overcome rising thermal and reliability challenges as advanced packages become more powerful, compact and complex?

## Design and Simulation

How can design and simulation tools help optimise package architectures, reduce development risk and accelerate the path from concept to production?


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