# AP International 2026 Speaker Profiles

AP International attracts industry leaders and academic experts shaping the materials, methods and technologies behind chip-level packaging and system integration.

Interested in speaking? Contact info@ap-international.net or call +44 (0)24 7671 8970.

## Speakers

- **Daniel Lieske** - Senior Expert Advanced Packaging, AEMtec
- **David Harame** - COO AIM Photonics and Associate Vice President for Process Development, EPDA, and Test Assembly and Packaging, AIM Photonics
- **Eoin O’Toole** - Research and Development Director, Amkor Technology
- **Mira Baraket** - Chief Technology Officer, ATLANT 3D
- **Jean-Charles Souriau** - Project leader and Expert in Wafer Level Packaging, CEA Leti
- **Diana Khlan** - Host, Chips Weekly
- **John Boston** - Managing Director, Custom Interconnect
- **Simon Cannonier** - Senior Technical Sales & Marketing Manager, cyberTECHNOLOGIES
- **Andre Schenk** - Technical Marketing Manager, Evatec
- **Travis Scott** - Product Manager & Business Development Manager, Finetech GmbH
- **Johannes Rittner** - Project Lead for Technology and Cooperation, FMD / APECS
- **Ulrike Ganesh** - Managing Director, Fraunhofer IZM
- **Gunther Roelkens** - Professor, Ghent University - imec
- **Himani Suhag Kamineni** - Director of Advanced Packaging, Central R&D, GlobalFoundries
- **Bert Offrein** - Principal Research Scientist, IBM
- **Joana Mendes** - Researcher, Instituto de Telecomunicações
- **Helio Fernandez Tellez** - EuroCDP Program Manager - Government Relations imec Spain, inTEC GROUP
- **Massimo Leo** - Sr. Product Line Manager - Photonics, Jabil
- **Christian Keil** - Director Business Development & Sales, Lidrotec GmbH
- **Ken MacWilliams** - President, Multibeam
- **Dr Gladys Benghalia** - Chief Technologist, National Advanced Semiconductor Packaging and Integration Centre (NASPIC)
- **Robert Patti** - President & CEO, NHanced Semiconductors
- **Dr. Pascal Oberndorff** - Senior Director Package Core Technology, Package Innovation, NXP Semiconductors
- **Anneirudh Sundararajan** - Project Manager R&I, PHIX Photonics Assembly
- **Paul Marchal** - Chief Executive Officer, Photon Bridge
- **David Forer** - Director Semiconductor Market Strategies, Physik Instrumente (PI) GmbH & Co. KG
- **Sylwester Latkowski** - Scientific Director, PITC
- **Sander Schellingerhout** - Application Engineer, Raith
- **Phillip Sundin** - Business Development Manager, SHELLBACK Semiconductor Technology
- **Bernhard Hammerl** - Head of Business Development, Siconnex
- **David Cheskis** - President, Square Zero Technologies
- **David Volk** - Product Manager Coating Systems, SUSS Micro Tec
- **Sebastiaan Muller** - Head of Sales & Business Development, Syenta
- **Finbarr Waldron** - Principal Engineer, Tyndall National Institute
- **Zeina Abdallah** - Senior Research Associate / Research Manager, University of Bristol
- **Laura Horan** - Head of Product Management, Vanguard Automation
- **Eric Mounier** - Chief Analyst, Photonics, Yole Group

---

Generated 2026-08-08 10:48 UTC from live event data. Canonical HTML page: https://ap-international.net/speakers