PRESENTATION

Foundry 2.0: A New Foundation for Semiconductors and Innovation

Gordon Moore predicted a “Day of Reckoning.” That day has arrived. Transistor sizes are approaching handfuls of atoms and while shrinks still continue, their benefits in economics, speed, and effective chip size have ground to a halt. However, as Moore predicted, there is another path forward that doesn’t rely on ever-shrinking devices. Advanced packaging is the new path, and it is at the core of the new industry model that is Foundry 2.0. Foundry 2.0 brings together the best of all technologies and material solutions by using the interconnect and manufacturing methods typically used in building semiconductor devices themselves. This foundry evolution, based on Advanced Packaging (AP), it is inherently a different business than today’s foundry model. This talk will discuss Foundry 2.0, the AP tool box and how the new AP centric foundry model leverages application specific systems of chiplets for cost reduction and innovation.