PRESENTATION

Advanced Packaging Methods for Heterogeneous Integration

As conventional semiconductor scaling approaches physical and economic limits, performance gains are increasingly achieved through optimised packaging architectures rather than smaller transistors alone. Advancements in co-packaged optics and heterogeneous integration, for example, enables the combination of diverse technologies such as logic, memory, photonics, sensors, and advanced materials to be assembled within a compact single system, placing new demands on package design, assembly strategy, and process control. This presentation explores how packaging architecture decisions directly influence system performance, yield, reliability, scalability, and time-to-market. It provides practical insight into the challenges of assembling complex systems and the methods used to optimise alignment and placement accuracy, bonding parameters and thermal/ mechanical stability. Emphasis is placed on modular, adaptable platforms that support evolving architectures and enable rapid process development from R&D to production. Attendees will gain a clearer understanding of how modular bonding and assembly technologies are used where current architectures are encounter limitations, and which solutions are proving effective in real development and production environments. The session will also highlight key factors shaping future packaging roadmaps and provide a foundation for technical discussion on designing architectures that balance performance, manufacturability, and flexibility.