PRESENTATION
Advanced Photonic Assembly for Co-Packaged Optics
The artificial intelligence induced compute explosion demands new technology and solutions at all system-levels. Advanced packaging concepts bring processing and memory chips closer together, enabling higher performance and better power-efficiency. For longer intra-system communication, pluggable optics is now a well-established solution. Co-packaging the optical modules with the processing and memory chips on the same substrate increases the overall bandwidth and improves power efficiency but also comes with assembly and integration challenges. This presentation will focus on photonic chip-to-fiber interfacing technology, scalability, density and compatibility with electrical assembly processes. The critical optical properties will be discussed.
Bert Offrein
IBM
Bert Jan Offrein received his Ph.D. degree from the University of Twente, The Netherlands, in 1994. He then joined IBM Research Europe - Zurich and contributed to establishing adaptive integrated optical technology for telecom networks. Since 2004, he has been a manager at IBM. He has been leading research on optical interconnects for computing systems, novel silicon-integrated neuromorphic technology for inferencing and training neural networks and most recently co-packaged optics. The research led by Bert Offrein was licensed and transferred to multiple companies, worldwide. He is a co-author of over 150 publications and co-inventor of over 40 patents. Bert Offrein is a Principal Research Scientist at IBM Research Europe-Zurich and Professor by special appointment at the University of Twente.