Micro-transfer printing (MTP) enables the integration of diverse materials and devices, such as III-V and LiNbO3 components, onto a single platform. With high alignment accuracy and efficient use of source material, MTP facilitates cutting-edge photonic integrated circuits (PICs), all while maintaining compatibility with existing manufacturing workflows. We will elaborate on the status of the TRANSVERSE pilot line that develops this technology on 200mm wafer silicon photonics wafers.
Gunther Roelkens is a senior full professor at Ghent University - imec. He is Fellow of Optica. His research interest includes the heterogeneous integration of III-V semiconductors and other materials on top of silicon waveguide circuits, for which he manages a 200mm pilot line, and electronic/photonic co-integration for communication applications.