PRESENTATION

Assembly Design Kit Challenges and Opportunities

We are in an exciting era of silicon photonics technology and packaging, where photonic integrated circuits (PICs) are heterogeneously assembled with both electronic integrated circuits (EICs) and a broad range of optical components. Packaging technologies such as micro-transfer printing enable the integration of III–V lasers, amplifiers, and high-speed modulators, with optical connectivity provided by printed microlenses and photonic wire bonds. In parallel, hybrid bonding and through-silicon vias are enabling dense 3D EIC–PIC integration. To capitalize on these advances at the system level, designers need standardized assembly data, rules, and models that capture both the physical and behavioral views of the interfaces across domains. The AIM Photonics’ Assembly Design Kit (ADK) provides this enablement through layout automation, design rules, electrical and optical models, simulation workflows, and prototype boards. By integrating the ADK with the AIM Photonics design PDK, we create a seamless path from PIC design to packaged prototypes. Our goal is to make advanced packaging accessible to a broader design community and accelerate system innovation for next-generation applications.