PRESENTATION

Eliminating Sub-Micron Alignment: Self-Aligned Cantilever Packaging for Scalable Silicon Photonics

As AI systems extend into sensing and physical interaction, photonic packaging requirements shift toward scalable heterogeneous integration, optical power handling, and manufacturability. We present a silicon photonics (SiPh) packaging platform for multi-wavelength light sources targeting external light source (ELS) and sensing applications. The platform uses a cantilever-based assembly method that enables deterministic integration of arbitrary materials onto SiPh. Cantilevers self-align during placement and are assembled using standard pick-and-place tools with 2–3 µm accuracy in 16 optical connections per placement without sub-micron active alignment. Large cross-section waveguides relax CD tolerances by >10× while supporting optical power densities exceeding 5 × 10⁷ W/cm², enabling a high-yield, manufacturable packaging solution for ELS, spectrometers, and LiDAR.