PRESENTATION

Digital Coating: Scalable and Material Saving Material Deposition

Inkjet printing is emerging as a scalable additive technology for semiconductor manufacturing, particularly in advanced back end processes. It enables precise, digital deposition of functional materials such as photoresists and polyimides, offering an efficient alternative to conventional spin coating and photolithography. Selective inkjet deposition allows uniform coating over complex topographies—including cavities and edges—while significantly reducing material consumption and waste, especially for costly resists. The ability to deposit material only where needed, with adjustable thickness and real time pattern adaptation, enhances process control and supports device customization. Printing and exposure results from various materials will be presented. Further applications include MEMS and power semiconductor fabrication, where inkjet printed resists enable patterning without photolithography. This streamlines process flows and supports ESG objectives by lowering chemical usage and energy demand. The system architecture accommodates flexible substrate formats, from wafers to large IC substrates, and contributes to cost efficient, flexible, and environmentally responsible semiconductor production.