Presentation by AEMtec

Daniel Lieske

AEMtec

Daniel Lieske is Senior Expert for Advanced Packaging Technologies at AEMtec in Berlin. In this role, he supports both product and process development teams and advises the sales department on new customer projects. His technical focus includes advanced packaging technologies such as Fan-Out WLP, RDL, Flip Chip, and photonics packaging, ensuring that AEMtec meets current and future market demands. He holds a diploma in Microelectronics and Microsystems from Brandenburg University of Technology in Cottbus. Daniel began his career as a Process Engineer at Infineon Technologies Dresden and Qimonda, working in the Backend on development, production, and technology transfer of multi‑chip modules to high‑volume manufacturing sites. As a Project Engineer at Freudenberg Mechatronics, he developed and optimized production equipment for automotive lighting applications. For the past 15 years at AEMtec, he has been responsible for wafer‑level solder ball attach, printing technologies, solder reflow, and failure analysis.