PRESENTATION

Beyond the Standard: Redefining Semiconductor Packaging as a Specialized OSAT

Discover how AEMtec transformed from an IDM into a leading specialized OSAT, carving out a unique position in the European semiconductor landscape. While industry roadpaths often follow rigid lines, AEMtec thrives on complexity: we build custom-specific package designs that lay the groundwork for future technologies. Our presentation highlights a unique process portfolio powered by state-of-the-art equipment. We bridge the gap between high-end backend services - including Wafer Test, UBM, RDL, and Dicing - and precision assembly such as High-Accuracy Die Bonding, Flip Chip, and Wire Bond. The final edge: integrating these packages into large-scale systems under the highest cleanliness and vacuum standards (Grade 1 & 2) for global market leaders.

Daniel Lieske

AEMtec

Daniel Lieske is Senior Expert for Advanced Packaging Technologies at AEMtec in Berlin. In this role, he supports both product and process development teams and advises the sales department on new customer projects. His technical focus includes advanced packaging technologies such as Fan-Out WLP, RDL, Flip Chip, and photonics packaging, ensuring that AEMtec meets current and future market demands. He holds a diploma in Microelectronics and Microsystems from Brandenburg University of Technology in Cottbus. Daniel began his career as a Process Engineer at Infineon Technologies Dresden and Qimonda, working in the Backend on development, production, and technology transfer of multi‑chip modules to high‑volume manufacturing sites. As a Project Engineer at Freudenberg Mechatronics, he developed and optimized production equipment for automotive lighting applications. For the past 15 years at AEMtec, he has been responsible for wafer‑level solder ball attach, printing technologies, solder reflow, and failure analysis.