PRESENTATION

Photonics Packaging Moving Toward Scalability for a Fast-growing Market

As photonics moves closer to compute in AI data centers , display engines shrink for AR form factors, and quantum technologies push toward scalable systems, photonics packaging is becoming a decisive market-growth enabler. Start-ups are proving silicon photonics functions across communications, computing, and sensing—but these breakthroughs will only become products if they can be packaged with high-volume, manufacturable approaches. In parallel, foundries and assembly houses are ramping dedicated platforms and PDKs to support emerging photonic architectures, exemplified by initiatives like TSMC’s COUPE within the broader CoWoS ecosystem. Spanning die integration (2.5D/3D), fiber coupling, encapsulation, and testing, photonics packaging faces stricter tolerances and multi-physics constraints than microelectronics, yet must ultimately adopt microelectronics-style repeatability, yield control, and process integration to scale—driving new requirements across wafer-level processing, bonding, precision etch/deposition, and test, and making ecosystem-wide orchestration by foundries, OSATs, and platform owners essential. This talk will review the trends for photonics packaging, the industrial landscape and market forecasts.