Johannes Rittner
Project Lead for Technology and Cooperation
FMD / APECS
Johannes Rittner is a graduate engineer specializing in mechatronics with a long-standing professional career. Over the years, he has consistently applied and further developed his technical expertise, complemented by a Master of Business Administration earned in Cambridge and Berlin. He has held a range of senior roles, including project manager in microelectronics, analyst, and positions in strategic business development across industry, research, and publicly funded initiatives. He also brings extensive experience in coordinating large-scale national and European projects funded by public programs. Within the FMD office, he currently serves as Project Lead for Technology and Cooperation at APECS.
Presentations
APECS Pilot Line: Shaping the Future of Heterogeneous Integration and Advanced Packaging
The pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« (APECS) is a central initiative within the EU Chips Act. It aims to foster innovation in chiplet technologies and strengthen Europe’s semiconductor research and manufacturing capabilities. The presentation highlights the pilot line’s key technologies, including 2.5D/3D chiplet integration, characterization, testing, and reliability (CTR), as well as system design. It demonstrates both the potential and the complexity of advanced heterogeneous system integration and packaging through four demonstrators. Finally, it outlines how industry and research organizations can access APECS technologies to accelerate their innovation.