Simon Cannonier
Senior Technical Sales & Marketing Manager
cyberTECHNOLOGIES
Simon Cannonier is Senior Technical Sales & Marketing Manager at cyberTECHNOLOGIES, a leading developer and manufacturer of high-resolution, non-contact 3D optical metrology solutions for semiconductor manufacturing. With more than a decade of experience in the semiconductor and microelectronics industry, he brings deep expertise in optical metrology across front-end wafer processing and advanced packaging applications. Leading an international technical team, he works closely with foundries, IDMs, OSATs, and semiconductor companies worldwide to develop and implement metrology solutions that address emerging process challenges.
Presentations
Advanced Metrology for the Challenges of Advanced Packaging
Optical metrology has long been a key enabler in semiconductor manufacturing. As AI and HPC drive demand for performance, bandwidth, and energy efficiency, the industry is rapidly advancing packaging technologies such as 2.5D/3D integration, chiplets, panel-level packaging, and hybrid bonding. These next-generation architectures introduce increasingly complex three-dimensional structures, tighter tolerances, and new material combinations. Pushing conventional inspection methods to their limits and requiring optical metrology to evolve alongside these developments. This presentation explores how advanced optical metrology addresses these challenges and enables the development and production of next-generation semiconductor packages. Measurement approaches for key process steps will be highlighted, demonstrating how high-resolution surface metrology provides precise characterization of complex structures while improving process insight, control, and yield. In addition, the presentation illustrates how modern optical metrology supports reliable device integration and extends its value across further stages of the semiconductor manufacturing process.