A Sustainable Dicing Innovation for Cutting-Edge Semiconductor Challenges

The production of semiconductor components (chips) is realized on thin wafers and is an energy and resource-intensive process that can take up to 12 weeks. Before the chips can be further processed, they must be separated on the wafer by the so-called dicing - a critical process step that introduces considerable damage to the chip frontside, backside and sidewalls. The market development of recent years combined with the AI boom leads to a high demand for computing power and data storage, e.g. for training of AI models and in consequence leads to a steady increase in energy consumption. To counteract rising energy consumption, innovative, more efficient product designs, e.g. HBM, are required. These are mostly achieved by a broader use of modern packaging methods e.g. Advanced Packaging and Hybrid Bonding. Unfortunately, these modern packaging and bonding methods lead to an increasing demand on chip quality and cleanliness, which cannot be achieved with most of the currently used dicing methods. As a result, semiconductor manufacturers have to utilize complex multi-step separation processes, including plasma dicing, which are not only expensive but also consume a large amount of chemical process gases. Our innovative LidroCUT® process based on USP lasers in liquid overcomes these challenges. The liquid binds the emerging particles leading to a debris free surface and contamination free sidewalls, enabling hybrid bonding without additional cleaning steps. Meanwhile, the cooling capacity of the liquid allows for a precise laser power use, leading to high quality edges and high break strength.