David Forer
Director Semiconductor Market Strategies
Physik
David Forer is a technology and strategy leader leading the semiconductor strategy at PI . His background includes roles in electronics and RF engineering, life-cycle management, business development, and corporate strategy throughout almost three decades in the semiconductor technology space. His current focus is enabling next generation solutions, including advanced packaging and heterogeneous integration, to move the semiconductor market forward into the angstrom era.
Presentations
Sub-Micron Active Alignment: Enabling Advanced Packaging at the Nanometer Level
As heterogeneous integration, chiplets, silicon photonics, and hybrid bonding more complex packaging, alignment is becoming a critical determinant of yield, throughput, and long-term reliability. We will explore how sub-micron active alignment; built on high-dynamics motion systems, multi-axis control, and nanometer-resolution positioning - helps close the gap between design intent and manufacturable reality. It will examine where active alignment creates the most value across advanced packaging flows, including optical coupling, die attach, wafer-level integration, and other precision assembly steps where tighter tolerances directly affect performance and scalability. Also to be addressed, the practical trade-offs between speed, accuracy, stability, and TCO, and show how precision motion platforms such as piezo-driven fine positioning, hexapod kinematics, and hybrid coarse/fine architectures can support next-generation packaging at industrial scale. Active alignment is more than a niche capability, it is a core enabler for packaging in the angstrom era.