Silicon to Systems: How Advanced Packaging Is Redefining Performance Scaling

As traditional transistor scaling faces economic, power, and physical limits, performance leadership in advanced computing is increasingly defined at the system level. Modern AI and high-performance systems are now constrained less by compute capability and more by data movement, power delivery, thermal management, and integration efficiency. This presentation explores how advanced packaging has evolved from a back-end manufacturing step into a first-order performance enabler. By enabling millimeter-scale interconnects, heterogeneous integration, and chiplet-based architectures, advanced packaging allows logic, memory, power, and I/O to be optimized independently while operating as a single system. Through system-level observations from recent AI and high-performance designs, the talk highlights why packaging choices now directly impact energy efficiency, yield economics, and sustained performance. The session concludes by examining why co-optimization across silicon, packaging, materials, and system architecture has become essential for continued scaling - and what this shift means for the future structure of computing.