Travis Scott
Product Manager & Business Development Manager
Finetech GmbH
Travis Scott is a specialist in advanced packaging, precision bonding and assembly of microelectronics, opto-electronics and photonics, and high-performance automation for industry, known for bridging deep-tech engineering with product and business strategy. At Finetech, he drives product management and international business development across China, APAC, EMEA, and North America, for a wide range of applications. His work focuses on enabling scalable automation and next-generation flip-chip and die-bonding solutions. Previously, Travis contributed to next-generation access-control and building-automation technologies as an Engineer at 1aim, and earlier built a strong foundation in precision manufacturing as a CNC Machinist and Toolmaker at EDM Zone. He is also active in the broader tech community, who served as co-coordinator of meetup.ai Berlin and as a founding member of the Good Technology Collective, a think tank focused on responsible innovation in AI. Combining international experience with cross-industry technical depth, Travis delivers clear, actionable insights that make complex deep-tech topics accessible to both technical and executive audiences.
Presentations
Advanced Packaging Methods for Heterogeneous Integration
As traditional semiconductor scaling reaches its limits, heterogeneous integration is becoming a key enabler for next-generation systems. In this context, advanced packaging, bonding, and assembly are no longer supporting processes, they are central drivers of system performance, yield, and time-to-market. This presentation provides practical insight into the real-world challenges of advanced packaging for heterogeneous integration and how they are being addressed today. It highlights critical topics such as high-accuracy die placement, sub-micron alignment, force-controlled bonding, and modular, reconfigurable process platforms. Attendees will gain a clearer understanding of where current approaches reach their limits, which solutions are proving effective in production environments, and how process flexibility can support evolving integration strategies. By attending this live session, participants will learn which technology choices make a measurable difference in practice, how to adapt processes to new heterogeneous integration concepts, and which factors are likely to shape future roadmaps. The presentation is designed to provide actionable insight and a strong basis for technical discussion with peers and experts.