Himani Suhag Kamineni
Director of Advanced Packaging, Central R&D
GlobalFoundries
Dr. Kamineni is the Director of Advanced Packaging and a Distinguished Member of Technical Staff (DMTS). She holds a Ph.D. in Nanoscale Science from CNSE (Albany, NY). After graduation, she joined GlobalFoundries, where she held several roles in the Packaging organization. She then joined PsiQuantum, driving advanced packaging efforts to build a scalable photonic quantum computer. She rejoined GlobalFoundries in 2023 where she served a one-year leadership assignment as the Chief of Staff to the CTO. She now leads a diverse team of engineers who drive the advanced packaging R&D efforts that support all product lines.
Presentations
Heterogeneous Integration and Co-packaged Optics: Meeting AI Bandwidth Demand
As transistor scaling faces physical and economic limits, heterogeneous integration is emerging as a key enabler for advanced computing systems. By tightly integrating logic, memory, accelerators, and advanced interconnect technologies within a single package, heterogeneous integration enables scalable performance, improved energy efficiency, and architectural flexibility beyond monolithic designs. This presentation will explore how advanced packaging, chiplet architectures, and high bandwidth electrical and optical interconnects address the growing demands of artificial intelligence and datacentric workloads. Heterogeneous integration provides a practical path to extend system level scaling and unlock next generation computing architectures beyond Moore’s Law.