Bridging the Gap: Collaborative Industry - Research Ecosystems in Advanced Packaging

As the semiconductor industry moves toward heterogeneous integration, advanced packaging is indispensable for improving system performance. The rising complexity calls for a holistic approach that links innovation with scalable processes. Central are expanding lab-to-industry initiatives and collaborative research–industry consortia. By fostering tight ties between cutting-edge research and early industrial adoption, these platforms accelerate the transfer of disruptive technologies—such as 3D packaging and glass-panel packaging—from concept to high-volume manufacturing. They reduce early-stage risks by broadening access to shared infrastructure and top-tier expertise. This work highlights the bi-directionality of innovation and transfer, promoting a feedback loop that extends beyond traditional models. By channeling industrial insights on process instabilities, yield issues, and scalability challenges back into research, activities can be precisely aligned with real-world manufacturing needs. This ensures applied research targets the most pressing bottlenecks and accelerates actionable outcomes. For Europe, pilot lines hosted by FMD institutes within the APECS framework demonstrate that bidirectional knowledge transfer is feasible and ready to address modern semiconductor challenges.