Beyond the Mask: Multibeam Laser Lithography for Cost-effective, Flexible, and High-Precision Advanced Packaging

As the semiconductor industry transitions toward heterogeneous integration and Fan-Out Wafer-Level Packaging (FOWLP), manufacturers face significant process challenges that traditional mask-based lithography cannot easily address. Specifically, the unpredictable nature of die shift, substrate warpage, and severe surface topography often leads to overlay errors and yield loss1. This presentation explores the transformative advantages of direct-write Laser Beam Lithography (LBL) as a maskless solution tailored for these complexities. We will discuss how eliminating physical masks facilitates rapid prototyping, enabling immediate design adjustments and significantly accelerating development cycles in R&D and small batch production environments. Next, we will demonstrate how RAITHs LBL technology transcends the resolution limits of mask aligners, achieving feature sizes down to 500 nm for high-density interconnects. Beyond resolution, a key focus will be RAITHs hybrid autofocus strategy, which enables perfect writing over highly topological and warped substrates with over 600 μm range. Moreover, RAITHs LBL employs die-by-die alignment algorithms to dynamically distort exposure patterns, compensating for individual die misplacement.