Dr Gladys Benghalia
Head of Programmes for Electrification Manufacturing
National Manufacturing Institute Scotland
Dr Gladys Benghalia is a chartered engineer and PhD graduate in Mechanical Engineering, currently serving as Head of Programmes for Electrification Manufacturing at the National Manufacturing Institute Scotland (NMIS).
She earned her BEng (Hons) in Mechanical Engineering from the University of Strathclyde in 2011, followed by a PhD at the Weir Advanced Research Centre. Her doctoral work focused on developing a fatigue resistant weld cladding technology. After completing her PhD, she joined the Advanced Forming Research Centre (AFRC) in 2015 as a Research Associate in materials science. In that role, she led industry focused projects, working with partners like Rolls Royce and Boeing, to study residual stress characterisation, modelling and validation in forged and formed components.
Gladys is currently leading the technical development of NASPIC (National Semiconductor Packaging and Integration Centre), driving the establishment of advanced UK packaging capabilities to scale up back-end processes, from wafer receipt to fully packaged devices and integrated subsystems.
Presentations
From Capability to Scale: Accelerating the Advanced Packaging Ecosystem
Advanced packaging is essential for enabling system performance, resilience and high value product architectures. As complexity grows, the challenge is not only innovation but translating new concepts into scalable, repeatable manufacturing. This presentation examines how aligning technology choices, process readiness and collaborative development supports industry in advancing new concepts towards production. Key topics include bridging prototypes to stable, high yield production, selecting bonding, assembly and interconnect strategies that support rapid scale-up, and deploying flexible platforms that embed design for manufacture and reliability. The talk also highlights how medium volume manufacturing provides a controlled environment to mitigate adoption risks, shorten learning cycles and provide OEMs and system integrators earlier access to advanced packaging capabilities.