Nick Russel
Chairman
RAM Innovations
Nick Russel is an industrial technology leader and currently the Executive Chairman of RAM Innovations, who are leading the development and scale-up of panel-level embedded die packaging platforms for GaN and SiC power modules. Nick’s technological experience spans satellites, batteries, electronics manufacturing and semiconductor packaging, addressing multiple markets including aerospace, defence, industrial and automotive. Nick has acquired, scaled and exited multiple engineering businesses and is actively involved in building innovation ecosystems, working with universities, OEMs and supply-chain partners to accelerate the translation of advanced semiconductor technologies into manufacturable, high-volume solutions.
Presentations
Panel-Level Embedded Die Packaging for High-Performance WBG Power Modules
Wide bandgap semiconductors such as GaN and SiC offer step-change improvements in power density and efficiency, but conventional packaging increasingly limits their performance. This paper presents a panel-level embedded die packaging platform developed by RAM Innovations to address parasitic inductance, thermal management, and scalability challenges. RAM has built a number of power module demonstrators using these packaging techniques showing >50% loop inductance reduction, lower switching losses, reduced EMI, and improved thermal spreading compared to conventional assemblies. The panel-level approach enables parallel, high-volume manufacture while maintaining performance advantages.