Nick Russel is an industrial technology leader and currently the Executive Chairman of RAM Innovations, who are leading the development and scale-up of panel-level embedded die packaging platforms for GaN and SiC power modules. Nick’s technological experience spans satellites, batteries, electronics manufacturing and semiconductor packaging, addressing multiple markets including aerospace, defence, industrial and automotive. Nick has acquired, scaled and exited multiple engineering businesses and is actively involved in building innovation ecosystems, working with universities, OEMs and supply-chain partners to accelerate the translation of advanced semiconductor technologies into manufacturable, high-volume solutions.