Dr. Zeina Abdallah is a senior researcher at the University of Bristol, working within the CDTR group. She is specializing in thermal management and device packaging. Her expertise includes thermal characterisation techniques such as Raman thermography and thermoreflectance technique, as well as thermal and thermomechanical simulations of electronic devices.
Efficient thermal management, particularly at the packaging level, is becoming increasingly crucial for high-power-density electronic devices. The heat spreader, onto which the semiconductor die is directly attached, is a key component of the package. Ideally, it should have high thermal conductivity while maintaining a compatible coefficient of thermal expansion (CTE). Metal diamond composites are promising candidates, as both their CTE and the thermal conductivity can be tailored to suit specific application. In this talk, we will present a comparative study of the thermal performance of metal-diamond composite heat spreaders versus standard materials, using frequency domain thermal reflectance, Raman thermography measurements, and finite element thermal simulations. We will also highlight the importance of the thermal interface materials (TIMs) in the overall thermal behavior of the package.