# AP International 2026 Programme

Two days of technical talks, panels and a dedicated poster session across heterogeneous integration, thermal management, packaging architectures and materials. Sessions and timings below are subject to change.

## Sunday 19 April 2026 (starting at 11:00 CET)

- 11:00 - AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register
- 18:00 - Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

## Monday 20 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Conference Chair

**Theme: Heterogeneous Integration**

- 09:00 - Silicon to Systems: How Advanced Packaging Is Redefining Performance Scaling - presented by Diana Khlan (Chips Weekly)
- 09:20 - Bridging the Gap: Collaborative Industry - Research Ecosystems in Advanced Packaging - presented by Ulrike Ganesh (Fraunhofer IZM)
- 09:40 - Sub-Micron Active Alignment: Enabling Advanced Packaging at the Nanometer Level - presented by David Forer (Physik Instrumente (PI) GmbH & Co. KG)
- 10:00 - Heterogeneous Integration and Co-packaged Optics: Meeting AI Bandwidth Demand - presented by Himani Suhag Kamineni (GlobalFoundries)
- 10:20 - Advanced Photonic Assembly for Co-Packaged Optics - presented by Bert Offrein (IBM)
- 10:40 - Morning Break - Refreshments & Networking
- 11:10 - Foundry 2.0: A New Foundation for Semiconductors and Innovation - presented by Robert Patti (NHanced Semiconductors)
- 11:30 - Localized Electrochemical Manufacturing (LEM): A Scalable High-Density Interconnect Platform for Next-Generation Heterogeneous Integration - presented by Sebastiaan Muller (Syenta)
- 11:50 - Thin Film Deposition Developments for Large Size Packages on Panel Scale - presented by Andre Schenk (Evatec)
- 12:10 - From Innovation to High-Volume Production: Scaling Heterogeneous Integration and Co-Packaged Optics - presented by Anneirudh Sundararajan (PHIX Photonics Assembly)
- 12:30 - Lunch Break, Networking & Posters

**Theme: Manufacturing & Pilot Lines**

- 14:00 - Supporting the European Advanced Packaging Ecosystem in HVM and Innovation - presented by Eoin O’Toole (Amkor Technology)
- 14:20 - Process Integration in Redistribution Layer Manufacturing - presented by Bernhard Hammerl (Siconnex)
- 14:40 - Assembly Design Kit Challenges and Opportunities - presented by David Harame (AIM Photonics)
- 15:00 - APECS Pilot Line: Shaping the Future of Heterogeneous Integration and Advanced Packaging - presented by Johannes Rittner (FMD / APECS)
- 15:20 - Advanced Photonics Packaging in the AI Era - presented by Massimo Leo (Jabil)
- 15:40 - Afternoon Break and Networking

**Theme: Materials, Design and Reliability**

- 16:10 - The European Chip Design Platform (EuroCDP): Enabling Access to Advanced Semiconductor Design in Europe - presented by Helio Fernandez Tellez (Imec)
- 16:30 - From Miniaturization to System Integration: The Growing Role of Semiconductor Packaging - presented by Dr. Pascal Oberndorff (NXP Semiconductors)
- 16:50 - Next-Generation Silicon Photonics Platforms Enabled by Micro-Transfer Printing – The TRANSVERSE Pilot Line - presented by Gunther Roelkens (Ghent University - imec)
- 17:10 - Design Enablement of a Heterogeneously Integrated Electronic-Photonic System in a Package - presented by Sylwester Latkowski (PITC)
- 17:30 - Packaging Reliability for Space and High Reliability Environments - presented by Finbarr Waldron (Tyndall National Institute)
- 17:50 - Closing Remarks
- 18:00 - Networking Drinks and Dinner Reception (concludes around 20:00)
- 18:30 - AngelTech Rump Session - Bottlenecks & Battlegrounds: The Future of the AI Chip Ecosystem - presented by David Cheskis (Square Zero Technologies), Diana Khlan (Chips Weekly)

## Tuesday 21 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Conference Chair

**Theme: Advancing Thermal Management**

- 09:00 - Beating the Heat: Diamond as an Enabler for High-Performance Advanced Packages - presented by Joana Mendes (Instituto de Telecomunicações)
- 09:20 - Advanced Thermal Management in High-Power Electronics Packaging Using Metal-Diamond Composite Heat Spreaders - presented by Zeina Abdallah (University of Bristol)
- 09:40 - Direct Atomic Layer Processing (DALP®): Spatially Localized, Multi-Material Fabrication for Next-Generation Devices from Discovery to Manufacturing - presented by Mira Baraket (ATLANT 3D)

**Theme: Getting the Best Out of Incumbent Solutions**

- 10:00 - From Capability to Scale: Accelerating the Advanced Packaging Ecosystem - presented by Dr Gladys Benghalia (National Advanced Semiconductor Packaging and Integration Centre (NASPIC))
- 10:20 - Beyond the Mask: Multibeam Laser Lithography for Cost-effective, Flexible, and High-Precision Advanced Packaging - presented by Sander Schellingerhout (Raith)
- 10:40 - Optimising Legacy Wet Strip for Advanced Packaging - presented by Phillip Sundin (SHELLBACK Semiconductor Technology)
- 11:00 - Morning Break and Networking
- 11:30 - Beyond the Standard: Redefining Semiconductor Packaging as a Specialized OSAT - presented by Daniel Lieske (AEMtec)
- 11:50 - Medium Volume Production and Advanced Packaging in the UK - presented by John Boston (Custom Interconnect)
- 12:10 - Photonics Packaging Moving Toward Scalability for a Fast-growing Market - presented by Eric Mounier (Yole Group)
- 12:30 - Lunch Break, Networking & Posters

**Theme: Optimising Packaging Architectures**

- 13:40 - Recent Developments in Advanced Heterogeneous 3D Integration at the Wafer Level - presented by Jean-Charles Souriau (CEA Leti)
- 14:00 - Photonic Wire Bonds and Facet-Attached Micro-Lenses: Enabling Scalable Integration of Lasers and PICs - presented by Laura Horan (Vanguard Automation)
- 14:20 - Advanced Metrology for the Challenges of Advanced Packaging - presented by Simon Cannonier (cyberTECHNOLOGIES)
- 14:40 - A Sustainable Dicing Innovation for Cutting-Edge Semiconductor Challenges - presented by Christian Keil (Lidrotec GmbH)
- 15:00 - Afternoon Coffee Break
- 15:30 - Advanced Packaging Methods for Heterogeneous Integration - presented by Travis Scott (Finetech GmbH)
- 15:50 - Digital Coating: Scalable and Material Saving Material Deposition - presented by David Volk (SUSS Micro Tec)
- 16:10 - Accelerating the Future: Enabling the Next Era of Advanced Integration with Multibeam- High-Productivity E-Beam Lithography - presented by Ken MacWilliams (Multibeam)
- 16:30 - Eliminating Sub-Micron Alignment: Self-Aligned Cantilever Packaging for Scalable Silicon Photonics - presented by Paul Marchal (Photon Bridge)
- 16:50 - Closing Remarks

Sessions and timings are subject to change.

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